Reliability in MID - barriers, potentials, fields of action

C. Fechtelpeter, C. Jürgenhake, R. Dumitrescu, T. Mager, K.-P. Fritz, T. Grötzinger, H. Müller, P. Wild, A. Zimmermann, in: 12th International Congress on Molded Interconnect Devices, Conference Proceedings , 28. - 30. Sep. 2016, 2016.

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12th International Congress on Molded Interconnect Devices, Conference Proceedings , 28. - 30. Sep. 2016
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Fechtelpeter C, Jürgenhake C, Dumitrescu R, et al. Reliability in MID - barriers, potentials, fields of action. In: 12th International Congress on Molded Interconnect Devices, Conference Proceedings , 28. - 30. Sep. 2016. ; 2016.
Fechtelpeter, C., Jürgenhake, C., Dumitrescu, R., Mager, T., Fritz, K.-P., Grötzinger, T., … Zimmermann, A. (2016). Reliability in MID - barriers, potentials, fields of action. In 12th International Congress on Molded Interconnect Devices, Conference Proceedings , 28. - 30. Sep. 2016.
@inproceedings{Fechtelpeter_Jürgenhake_Dumitrescu_Mager_Fritz_Grötzinger_Müller_Wild_Zimmermann_2016, title={Reliability in MID - barriers, potentials, fields of action}, booktitle={12th International Congress on Molded Interconnect Devices, Conference Proceedings , 28. - 30. Sep. 2016}, author={Fechtelpeter, Christian and Jürgenhake, Christoph and Dumitrescu, Roman and Mager, Thomas and Fritz, Karl-Peter and Grötzinger, Tobias and Müller, Hagen and Wild, Paul and Zimmermann, Andre}, year={2016} }
Fechtelpeter, Christian, Christoph Jürgenhake, Roman Dumitrescu, Thomas Mager, Karl-Peter Fritz, Tobias Grötzinger, Hagen Müller, Paul Wild, and Andre Zimmermann. “Reliability in MID - Barriers, Potentials, Fields of Action.” In 12th International Congress on Molded Interconnect Devices, Conference Proceedings , 28. - 30. Sep. 2016, 2016.
C. Fechtelpeter et al., “Reliability in MID - barriers, potentials, fields of action,” in 12th International Congress on Molded Interconnect Devices, Conference Proceedings , 28. - 30. Sep. 2016, 2016.
Fechtelpeter, Christian, et al. “Reliability in MID - Barriers, Potentials, Fields of Action.” 12th International Congress on Molded Interconnect Devices, Conference Proceedings , 28. - 30. Sep. 2016, 2016.

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