Optimized process sequences for prototyping of molded interconnect devices
C. Jürgenhake, C. Fechtelpeter, R. Dumitrescu, D. Heidsiek, Advanced Materials Research Vol.1038 (2014) 19–27.
Download
No fulltext has been uploaded.
Newspaper Article
| English
Author
Jürgenhake, Christoph;
Fechtelpeter, Christian;
Dumitrescu, RomanLibreCat;
Heidsiek, Daniel
Publishing Year
Newspaper Title
Advanced Materials Research
Volume
Vol.1038
Page
19-27
LibreCat-ID
Cite this
Jürgenhake C, Fechtelpeter C, Dumitrescu R, Heidsiek D. Optimized process sequences for prototyping of molded interconnect devices. Advanced Materials Research. 2014:19-27.
Jürgenhake, C., Fechtelpeter, C., Dumitrescu, R., & Heidsiek, D. (2014). Optimized process sequences for prototyping of molded interconnect devices. Advanced Materials Research, pp. 19–27.
@article{Jürgenhake_Fechtelpeter_Dumitrescu_Heidsiek_2014, title={Optimized process sequences for prototyping of molded interconnect devices}, volume={Vol.1038}, journal={Advanced Materials Research}, author={Jürgenhake, Christoph and Fechtelpeter, Christian and Dumitrescu, Roman and Heidsiek, Daniel}, year={2014}, pages={19–27} }
Jürgenhake, Christoph, Christian Fechtelpeter, Roman Dumitrescu, and Daniel Heidsiek. “Optimized Process Sequences for Prototyping of Molded Interconnect Devices.” Advanced Materials Research, 2014.
C. Jürgenhake, C. Fechtelpeter, R. Dumitrescu, and D. Heidsiek, “Optimized process sequences for prototyping of molded interconnect devices,” Advanced Materials Research, vol. Vol.1038, pp. 19–27, 2014.
Jürgenhake, Christoph, et al. “Optimized Process Sequences for Prototyping of Molded Interconnect Devices.” Advanced Materials Research, vol. Vol.1038, 2014, pp. 19–27.
Google Scholar