Approach for a modular design methodology for an efficient development of 3D MID components
T. Mager, C. Jürgenhake, R. Dumitrescu, in: 14th International Congress Molded Interconnect Devices (MID), 2021, pp. 1–9.
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Conference Paper
| Published
| English
Author
Mager, Thomas;
Jürgenhake, Christoph;
Dumitrescu, RomanLibreCat
Publishing Year
Proceedings Title
14th International Congress Molded Interconnect Devices (MID)
Page
1-9
Conference
International Congress Molded Interconnect Devices (MID)
Conference Location
Amberg
Conference Date
2021-02-9 – 2021-02-10
LibreCat-ID
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Mager T, Jürgenhake C, Dumitrescu R. Approach for a modular design methodology for an efficient development of 3D MID components. In: 14th International Congress Molded Interconnect Devices (MID). ; 2021:1-9.
Mager, T., Jürgenhake, C., & Dumitrescu, R. (2021). Approach for a modular design methodology for an efficient development of 3D MID components. 14th International Congress Molded Interconnect Devices (MID), 1–9.
@inproceedings{Mager_Jürgenhake_Dumitrescu_2021, title={Approach for a modular design methodology for an efficient development of 3D MID components}, booktitle={14th International Congress Molded Interconnect Devices (MID)}, author={Mager, Thomas and Jürgenhake, Christoph and Dumitrescu, Roman}, year={2021}, pages={1–9} }
Mager, Thomas, Christoph Jürgenhake, and Roman Dumitrescu. “Approach for a Modular Design Methodology for an Efficient Development of 3D MID Components.” In 14th International Congress Molded Interconnect Devices (MID), 1–9, 2021.
T. Mager, C. Jürgenhake, and R. Dumitrescu, “Approach for a modular design methodology for an efficient development of 3D MID components,” in 14th International Congress Molded Interconnect Devices (MID), Amberg, 2021, pp. 1–9.
Mager, Thomas, et al. “Approach for a Modular Design Methodology for an Efficient Development of 3D MID Components.” 14th International Congress Molded Interconnect Devices (MID), 2021, pp. 1–9.
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