Pattern-Based Integrative Design of Molded Interconnect Devices (MID)
R. Dumitrescu, T. Gaukstern, C. J{\"u}rgenhake, J. Gausemeier, Arno K{\"u}hn, in: 2012.
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Conference Paper
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| English
Author
Dumitrescu, RomanLibreCat;
Gaukstern, Tobias;
J{\"u}rgenhake, Christoph ;
Gausemeier, J{\"u}rgen ;
K{\"u}hn, Arno
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Dumitrescu R, Gaukstern T, J{\"u}rgenhake C, Gausemeier J, K{\"u}hn Arno. Pattern-Based Integrative Design of Molded Interconnect Devices (MID). In: ; 2012.
Dumitrescu, R., Gaukstern, T., J{\"u}rgenhake, C., Gausemeier, J., & K{\"u}hn, Arno. (2012). Pattern-Based Integrative Design of Molded Interconnect Devices (MID).
@inproceedings{Dumitrescu_Gaukstern_J{\"u}rgenhake_Gausemeier_K{\"u}hn_2012, title={Pattern-Based Integrative Design of Molded Interconnect Devices (MID)}, author={Dumitrescu, Roman and Gaukstern, Tobias and J{\"u}rgenhake, Christoph and Gausemeier, J{\"u}rgen and K{\"u}hn, Arno}, year={2012} }
Dumitrescu, Roman, Tobias Gaukstern, Christoph J{\"u}rgenhake, J{\"u}rgen Gausemeier, and Arno K{\"u}hn. “Pattern-Based Integrative Design of Molded Interconnect Devices (MID),” 2012.
R. Dumitrescu, T. Gaukstern, C. J{\"u}rgenhake, J. Gausemeier, and Arno K{\"u}hn, “Pattern-Based Integrative Design of Molded Interconnect Devices (MID),” 2012.
Dumitrescu, Roman, et al. Pattern-Based Integrative Design of Molded Interconnect Devices (MID). 2012.