Spin-electronic devices with half-metallic Heusler alloys
A. Hütten, J. Schmalhorst, A. Thomas, S. Kämmerer, M. Sacher, D. Ebke, N.-N. Liu, X. Kou, G. Reiss, Journal of Alloys and Compounds 423 (2006) 148–152.
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Journal Article
| Published
| English
Author
Hütten, A.;
Schmalhorst, J.;
Thomas, A.;
Kämmerer, S.;
Sacher, MarcLibreCat 
;
Ebke, D.;
Liu, N.-N.;
Kou, X.;
Reiss, G.
;
Ebke, D.;
Liu, N.-N.;
Kou, X.;
Reiss, G.Department
Publishing Year
Journal Title
Journal of Alloys and Compounds
Volume
423
Issue
1-2
Page
148-152
ISSN
LibreCat-ID
Cite this
Hütten A, Schmalhorst J, Thomas A, et al. Spin-electronic devices with half-metallic Heusler alloys. Journal of Alloys and Compounds. 2006;423(1-2):148-152. doi:10.1016/j.jallcom.2005.12.106
Hütten, A., Schmalhorst, J., Thomas, A., Kämmerer, S., Sacher, M., Ebke, D., Liu, N.-N., Kou, X., & Reiss, G. (2006). Spin-electronic devices with half-metallic Heusler alloys. Journal of Alloys and Compounds, 423(1–2), 148–152. https://doi.org/10.1016/j.jallcom.2005.12.106
@article{Hütten_Schmalhorst_Thomas_Kämmerer_Sacher_Ebke_Liu_Kou_Reiss_2006, title={Spin-electronic devices with half-metallic Heusler alloys}, volume={423}, DOI={10.1016/j.jallcom.2005.12.106}, number={1–2}, journal={Journal of Alloys and Compounds}, publisher={Elsevier BV}, author={Hütten, A. and Schmalhorst, J. and Thomas, A. and Kämmerer, S. and Sacher, Marc and Ebke, D. and Liu, N.-N. and Kou, X. and Reiss, G.}, year={2006}, pages={148–152} }
Hütten, A., J. Schmalhorst, A. Thomas, S. Kämmerer, Marc Sacher, D. Ebke, N.-N. Liu, X. Kou, and G. Reiss. “Spin-Electronic Devices with Half-Metallic Heusler Alloys.” Journal of Alloys and Compounds 423, no. 1–2 (2006): 148–52. https://doi.org/10.1016/j.jallcom.2005.12.106.
A. Hütten et al., “Spin-electronic devices with half-metallic Heusler alloys,” Journal of Alloys and Compounds, vol. 423, no. 1–2, pp. 148–152, 2006, doi: 10.1016/j.jallcom.2005.12.106.
Hütten, A., et al. “Spin-Electronic Devices with Half-Metallic Heusler Alloys.” Journal of Alloys and Compounds, vol. 423, no. 1–2, Elsevier BV, 2006, pp. 148–52, doi:10.1016/j.jallcom.2005.12.106.
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