The use of radiation-cured adhesives on adhesive stud assembly process
G. Meschut, S. Süllentrop, Welding in the World 58 (2014) 755–762.
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Journal Article
| Published
| English
Author
Meschut, Gerson;
Süllentrop, Sebastian
Department
Publishing Year
Journal Title
Welding in the World
Volume
58
Issue
5
Page
755-762
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Meschut G, Süllentrop S. The use of radiation-cured adhesives on adhesive stud assembly process. Welding in the World. 2014;58(5):755-762. doi:10.1007/s40194-014-0176-1
Meschut, G., & Süllentrop, S. (2014). The use of radiation-cured adhesives on adhesive stud assembly process. Welding in the World, 58(5), 755–762. https://doi.org/10.1007/s40194-014-0176-1
@article{Meschut_Süllentrop_2014, title={The use of radiation-cured adhesives on adhesive stud assembly process}, volume={58}, DOI={10.1007/s40194-014-0176-1}, number={5}, journal={Welding in the World}, publisher={Springer Science and Business Media LLC}, author={Meschut, Gerson and Süllentrop, Sebastian}, year={2014}, pages={755–762} }
Meschut, Gerson, and Sebastian Süllentrop. “The Use of Radiation-Cured Adhesives on Adhesive Stud Assembly Process.” Welding in the World 58, no. 5 (2014): 755–62. https://doi.org/10.1007/s40194-014-0176-1.
G. Meschut and S. Süllentrop, “The use of radiation-cured adhesives on adhesive stud assembly process,” Welding in the World, vol. 58, no. 5, pp. 755–762, 2014, doi: 10.1007/s40194-014-0176-1.
Meschut, Gerson, and Sebastian Süllentrop. “The Use of Radiation-Cured Adhesives on Adhesive Stud Assembly Process.” Welding in the World, vol. 58, no. 5, Springer Science and Business Media LLC, 2014, pp. 755–62, doi:10.1007/s40194-014-0176-1.
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