Lift-off of mesoporous layers by electrochemical etching on Si (100) substrates with miscut of 6° off towards (111)

E. Garralaga Rojas, B. Terheiden, H. Plagwitz, J. Hensen, V. Wiedemeier, G. Berth, A. Zrenner, R. Brendel, Thin Solid Films 520 (2011) 606–609.

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Abstract
Uniform mesoporous Si double layers are formed on 4 inch p-type < 100> wafers with an off orientation of 6º towards < 111> by means of electrochemical etching in ethanoic-based HF electrolytes. These substrates are of interest for the epitaxial growth of III–V compound semiconductor stacks on their top for the production of multi-junction solar cells and very thin electronic devices. We demonstrate transfer of porous layers after an annealing process in hydrogen atmosphere. Electron Back-Scatter Diffraction analysis confirms that the substrate orientation is conserved during the etching and annealing steps. Confocal μ-Raman spectroscopy analysis shows a decrease in the Raman signal intensity after etching and a subsequent increase after annealing while no shift is observed. By means of Atomic Force Microscopy, analysis the surface appearance after the etching and annealing steps can be visualized. The mean surface roughness varies during the process from 0.55 nm for the unprocessed wafers to 0.27 nm after etching and 0.78 nm after annealing. The decrease of average roughness after etching is caused by an electropolishing step prior to porous formation. Despite of slight increase of mean surface roughness after annealing the samples are still appropriate for high quality epitaxial growth and subsequent lift-off.
Publishing Year
Journal Title
Thin Solid Films
Volume
520
Issue
1
Page
606-609
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Garralaga Rojas E, Terheiden B, Plagwitz H, et al. Lift-off of mesoporous layers by electrochemical etching on Si (100) substrates with miscut of 6° off towards (111). Thin Solid Films. 2011;520(1):606-609. doi:10.1016/j.tsf.2011.07.063
Garralaga Rojas, E., Terheiden, B., Plagwitz, H., Hensen, J., Wiedemeier, V., Berth, G., … Brendel, R. (2011). Lift-off of mesoporous layers by electrochemical etching on Si (100) substrates with miscut of 6° off towards (111). Thin Solid Films, 520(1), 606–609. https://doi.org/10.1016/j.tsf.2011.07.063
@article{Garralaga Rojas_Terheiden_Plagwitz_Hensen_Wiedemeier_Berth_Zrenner_Brendel_2011, title={Lift-off of mesoporous layers by electrochemical etching on Si (100) substrates with miscut of 6° off towards (111)}, volume={520}, DOI={10.1016/j.tsf.2011.07.063}, number={1}, journal={Thin Solid Films}, publisher={Elsevier BV}, author={Garralaga Rojas, E. and Terheiden, B. and Plagwitz, H. and Hensen, J. and Wiedemeier, V. and Berth, Gerhard and Zrenner, Artur and Brendel, R.}, year={2011}, pages={606–609} }
Garralaga Rojas, E., B. Terheiden, H. Plagwitz, J. Hensen, V. Wiedemeier, Gerhard Berth, Artur Zrenner, and R. Brendel. “Lift-off of Mesoporous Layers by Electrochemical Etching on Si (100) Substrates with Miscut of 6° off towards (111).” Thin Solid Films 520, no. 1 (2011): 606–9. https://doi.org/10.1016/j.tsf.2011.07.063.
E. Garralaga Rojas et al., “Lift-off of mesoporous layers by electrochemical etching on Si (100) substrates with miscut of 6° off towards (111),” Thin Solid Films, vol. 520, no. 1, pp. 606–609, 2011.
Garralaga Rojas, E., et al. “Lift-off of Mesoporous Layers by Electrochemical Etching on Si (100) Substrates with Miscut of 6° off towards (111).” Thin Solid Films, vol. 520, no. 1, Elsevier BV, 2011, pp. 606–09, doi:10.1016/j.tsf.2011.07.063.

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