Thermo-hydraulic Performance of Pillow-Plate Heat Exchangers with Secondary Structuring: A Numerical Analysis
R. Afsahnoudeh, A. Wortmeier, M. Holzmüller, Y. XGong, W. Homberg, E.Y. Kenig, Energies 16 (2023).
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Journal Article
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Afsahnoudeh, RezaLibreCat;
Wortmeier, Andreas;
Holzmüller, MaikLibreCat;
XGong, Yi;
Homberg, WernerLibreCat;
Kenig, Eugeny Y.LibreCat
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Journal Title
Energies
Volume
16
Issue
21
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Afsahnoudeh R, Wortmeier A, Holzmüller M, XGong Y, Homberg W, Kenig EY. Thermo-hydraulic Performance of Pillow-Plate Heat Exchangers with Secondary Structuring: A Numerical Analysis. Energies. 2023;16(21). doi:https://doi.org/10.3390/en16217284
Afsahnoudeh, R., Wortmeier, A., Holzmüller, M., XGong, Y., Homberg, W., & Kenig, E. Y. (2023). Thermo-hydraulic Performance of Pillow-Plate Heat Exchangers with Secondary Structuring: A Numerical Analysis. Energies, 16(21). https://doi.org/10.3390/en16217284
@article{Afsahnoudeh_Wortmeier_Holzmüller_XGong_Homberg_Kenig_2023, title={Thermo-hydraulic Performance of Pillow-Plate Heat Exchangers with Secondary Structuring: A Numerical Analysis}, volume={16}, DOI={https://doi.org/10.3390/en16217284}, number={21}, journal={Energies}, publisher={MDPI}, author={Afsahnoudeh, Reza and Wortmeier, Andreas and Holzmüller, Maik and XGong, Yi and Homberg, Werner and Kenig, Eugeny Y.}, year={2023} }
Afsahnoudeh, Reza, Andreas Wortmeier, Maik Holzmüller, Yi XGong, Werner Homberg, and Eugeny Y. Kenig. “Thermo-Hydraulic Performance of Pillow-Plate Heat Exchangers with Secondary Structuring: A Numerical Analysis.” Energies 16, no. 21 (2023). https://doi.org/10.3390/en16217284.
R. Afsahnoudeh, A. Wortmeier, M. Holzmüller, Y. XGong, W. Homberg, and E. Y. Kenig, “Thermo-hydraulic Performance of Pillow-Plate Heat Exchangers with Secondary Structuring: A Numerical Analysis,” Energies, vol. 16, no. 21, 2023, doi: https://doi.org/10.3390/en16217284.
Afsahnoudeh, Reza, et al. “Thermo-Hydraulic Performance of Pillow-Plate Heat Exchangers with Secondary Structuring: A Numerical Analysis.” Energies, vol. 16, no. 21, MDPI, 2023, doi:https://doi.org/10.3390/en16217284.
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