Optimization of Rate-Splitting Multiple Access in Beyond Diagonal RIS-assisted URLLC Systems
M. Soleymani, I. Santamaria, E. Jorswieck, B. Clerckx, IEEE Transactions on Wireless Communications (2023) 1–1.
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Journal Article
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| English
Author
Soleymani, Mohammad;
Santamaria, Ignacio;
Jorswieck, Eduard;
Clerckx, Bruno
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Publishing Year
Journal Title
IEEE Transactions on Wireless Communications
Page
1-1
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Soleymani M, Santamaria I, Jorswieck E, Clerckx B. Optimization of Rate-Splitting Multiple Access in Beyond Diagonal RIS-assisted URLLC Systems. IEEE Transactions on Wireless Communications. Published online 2023:1-1. doi:10.1109/twc.2023.3324190
Soleymani, M., Santamaria, I., Jorswieck, E., & Clerckx, B. (2023). Optimization of Rate-Splitting Multiple Access in Beyond Diagonal RIS-assisted URLLC Systems. IEEE Transactions on Wireless Communications, 1–1. https://doi.org/10.1109/twc.2023.3324190
@article{Soleymani_Santamaria_Jorswieck_Clerckx_2023, title={Optimization of Rate-Splitting Multiple Access in Beyond Diagonal RIS-assisted URLLC Systems}, DOI={10.1109/twc.2023.3324190}, journal={IEEE Transactions on Wireless Communications}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Soleymani, Mohammad and Santamaria, Ignacio and Jorswieck, Eduard and Clerckx, Bruno}, year={2023}, pages={1–1} }
Soleymani, Mohammad, Ignacio Santamaria, Eduard Jorswieck, and Bruno Clerckx. “Optimization of Rate-Splitting Multiple Access in Beyond Diagonal RIS-Assisted URLLC Systems.” IEEE Transactions on Wireless Communications, 2023, 1–1. https://doi.org/10.1109/twc.2023.3324190.
M. Soleymani, I. Santamaria, E. Jorswieck, and B. Clerckx, “Optimization of Rate-Splitting Multiple Access in Beyond Diagonal RIS-assisted URLLC Systems,” IEEE Transactions on Wireless Communications, pp. 1–1, 2023, doi: 10.1109/twc.2023.3324190.
Soleymani, Mohammad, et al. “Optimization of Rate-Splitting Multiple Access in Beyond Diagonal RIS-Assisted URLLC Systems.” IEEE Transactions on Wireless Communications, Institute of Electrical and Electronics Engineers (IEEE), 2023, pp. 1–1, doi:10.1109/twc.2023.3324190.
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