Rate Splitting in MIMO RIS-Assisted Systems With Hardware Impairments and Improper Signaling

M. Soleymani, I. Santamaria, E.A. Jorswieck, IEEE Transactions on Vehicular Technology 72 (2022) 4580–4597.

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Journal Article | Published | English
Author
Soleymani, Mohammad; Santamaria, Ignacio; Jorswieck, Eduard A.
Publishing Year
Journal Title
IEEE Transactions on Vehicular Technology
Volume
72
Issue
4
Page
4580-4597
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Soleymani M, Santamaria I, Jorswieck EA. Rate Splitting in MIMO RIS-Assisted Systems With Hardware Impairments and Improper Signaling. IEEE Transactions on Vehicular Technology. 2022;72(4):4580-4597. doi:10.1109/tvt.2022.3222633
Soleymani, M., Santamaria, I., & Jorswieck, E. A. (2022). Rate Splitting in MIMO RIS-Assisted Systems With Hardware Impairments and Improper Signaling. IEEE Transactions on Vehicular Technology, 72(4), 4580–4597. https://doi.org/10.1109/tvt.2022.3222633
@article{Soleymani_Santamaria_Jorswieck_2022, title={Rate Splitting in MIMO RIS-Assisted Systems With Hardware Impairments and Improper Signaling}, volume={72}, DOI={10.1109/tvt.2022.3222633}, number={4}, journal={IEEE Transactions on Vehicular Technology}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Soleymani, Mohammad and Santamaria, Ignacio and Jorswieck, Eduard A.}, year={2022}, pages={4580–4597} }
Soleymani, Mohammad, Ignacio Santamaria, and Eduard A. Jorswieck. “Rate Splitting in MIMO RIS-Assisted Systems With Hardware Impairments and Improper Signaling.” IEEE Transactions on Vehicular Technology 72, no. 4 (2022): 4580–97. https://doi.org/10.1109/tvt.2022.3222633.
M. Soleymani, I. Santamaria, and E. A. Jorswieck, “Rate Splitting in MIMO RIS-Assisted Systems With Hardware Impairments and Improper Signaling,” IEEE Transactions on Vehicular Technology, vol. 72, no. 4, pp. 4580–4597, 2022, doi: 10.1109/tvt.2022.3222633.
Soleymani, Mohammad, et al. “Rate Splitting in MIMO RIS-Assisted Systems With Hardware Impairments and Improper Signaling.” IEEE Transactions on Vehicular Technology, vol. 72, no. 4, Institute of Electrical and Electronics Engineers (IEEE), 2022, pp. 4580–97, doi:10.1109/tvt.2022.3222633.

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