Monocular visual simultaneous localization and mapping: (r)evolution from geometry to deep learning-based pipelines
O. Álvarez-Tuñón, Y. Brodskiy, E. Kayacan, IEEE Transactions on Artificial Intelligence (2023) 1–21.
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| English
Author
Álvarez-Tuñón, Olaya;
Brodskiy, Yury;
Kayacan, ErdalLibreCat
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Journal Title
IEEE Transactions on Artificial Intelligence
Page
1-21
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Álvarez-Tuñón O, Brodskiy Y, Kayacan E. Monocular visual simultaneous localization and mapping: (r)evolution from geometry to deep learning-based pipelines. IEEE Transactions on Artificial Intelligence. Published online 2023:1-21. doi:10.1109/tai.2023.3321032
Álvarez-Tuñón, O., Brodskiy, Y., & Kayacan, E. (2023). Monocular visual simultaneous localization and mapping: (r)evolution from geometry to deep learning-based pipelines. IEEE Transactions on Artificial Intelligence, 1–21. https://doi.org/10.1109/tai.2023.3321032
@article{Álvarez-Tuñón_Brodskiy_Kayacan_2023, title={Monocular visual simultaneous localization and mapping: (r)evolution from geometry to deep learning-based pipelines}, DOI={10.1109/tai.2023.3321032}, journal={IEEE Transactions on Artificial Intelligence}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Álvarez-Tuñón, Olaya and Brodskiy, Yury and Kayacan, Erdal}, year={2023}, pages={1–21} }
Álvarez-Tuñón, Olaya, Yury Brodskiy, and Erdal Kayacan. “Monocular Visual Simultaneous Localization and Mapping: (R)Evolution from Geometry to Deep Learning-Based Pipelines.” IEEE Transactions on Artificial Intelligence, 2023, 1–21. https://doi.org/10.1109/tai.2023.3321032.
O. Álvarez-Tuñón, Y. Brodskiy, and E. Kayacan, “Monocular visual simultaneous localization and mapping: (r)evolution from geometry to deep learning-based pipelines,” IEEE Transactions on Artificial Intelligence, pp. 1–21, 2023, doi: 10.1109/tai.2023.3321032.
Álvarez-Tuñón, Olaya, et al. “Monocular Visual Simultaneous Localization and Mapping: (R)Evolution from Geometry to Deep Learning-Based Pipelines.” IEEE Transactions on Artificial Intelligence, Institute of Electrical and Electronics Engineers (IEEE), 2023, pp. 1–21, doi:10.1109/tai.2023.3321032.
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