A new dynamic range directional measure for two-stage data envelopment analysis models with negative data

M. Tavana, M. Izadikhah, D. Di Caprio, R. Farzipoor Saen, Computers & Industrial Engineering 115 (2018) 427–448.

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Journal Article | Published | English
Author
Tavana, MadjidLibreCat; Izadikhah, Mohammad; Di Caprio, Debora; Farzipoor Saen, Reza
Publishing Year
Journal Title
Computers & Industrial Engineering
Volume
115
Page
427-448
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Tavana M, Izadikhah M, Di Caprio D, Farzipoor Saen R. A new dynamic range directional measure for two-stage data envelopment analysis models with negative data. Computers & Industrial Engineering. 2018;115:427-448. doi:10.1016/j.cie.2017.11.024
Tavana, M., Izadikhah, M., Di Caprio, D., & Farzipoor Saen, R. (2018). A new dynamic range directional measure for two-stage data envelopment analysis models with negative data. Computers & Industrial Engineering, 115, 427–448. https://doi.org/10.1016/j.cie.2017.11.024
@article{Tavana_Izadikhah_Di Caprio_Farzipoor Saen_2018, title={A new dynamic range directional measure for two-stage data envelopment analysis models with negative data}, volume={115}, DOI={10.1016/j.cie.2017.11.024}, journal={Computers & Industrial Engineering}, publisher={Elsevier BV}, author={Tavana, Madjid and Izadikhah, Mohammad and Di Caprio, Debora and Farzipoor Saen, Reza}, year={2018}, pages={427–448} }
Tavana, Madjid, Mohammad Izadikhah, Debora Di Caprio, and Reza Farzipoor Saen. “A New Dynamic Range Directional Measure for Two-Stage Data Envelopment Analysis Models with Negative Data.” Computers & Industrial Engineering 115 (2018): 427–48. https://doi.org/10.1016/j.cie.2017.11.024.
M. Tavana, M. Izadikhah, D. Di Caprio, and R. Farzipoor Saen, “A new dynamic range directional measure for two-stage data envelopment analysis models with negative data,” Computers & Industrial Engineering, vol. 115, pp. 427–448, 2018, doi: 10.1016/j.cie.2017.11.024.
Tavana, Madjid, et al. “A New Dynamic Range Directional Measure for Two-Stage Data Envelopment Analysis Models with Negative Data.” Computers & Industrial Engineering, vol. 115, Elsevier BV, 2018, pp. 427–48, doi:10.1016/j.cie.2017.11.024.

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