A multiple correspondence analysis model for evaluating technology foresight methods
M. Esmaelian, M. Tavana, D. Di Caprio, R. Ansari, Technological Forecasting and Social Change 125 (2017) 188–205.
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Journal Article
| Published
| English
Author
Esmaelian, Majid;
Tavana, MadjidLibreCat;
Di Caprio, Debora;
Ansari, Reza
Publishing Year
Journal Title
Technological Forecasting and Social Change
Volume
125
Page
188-205
ISSN
LibreCat-ID
Cite this
Esmaelian M, Tavana M, Di Caprio D, Ansari R. A multiple correspondence analysis model for evaluating technology foresight methods. Technological Forecasting and Social Change. 2017;125:188-205. doi:10.1016/j.techfore.2017.07.022
Esmaelian, M., Tavana, M., Di Caprio, D., & Ansari, R. (2017). A multiple correspondence analysis model for evaluating technology foresight methods. Technological Forecasting and Social Change, 125, 188–205. https://doi.org/10.1016/j.techfore.2017.07.022
@article{Esmaelian_Tavana_Di Caprio_Ansari_2017, title={A multiple correspondence analysis model for evaluating technology foresight methods}, volume={125}, DOI={10.1016/j.techfore.2017.07.022}, journal={Technological Forecasting and Social Change}, publisher={Elsevier BV}, author={Esmaelian, Majid and Tavana, Madjid and Di Caprio, Debora and Ansari, Reza}, year={2017}, pages={188–205} }
Esmaelian, Majid, Madjid Tavana, Debora Di Caprio, and Reza Ansari. “A Multiple Correspondence Analysis Model for Evaluating Technology Foresight Methods.” Technological Forecasting and Social Change 125 (2017): 188–205. https://doi.org/10.1016/j.techfore.2017.07.022.
M. Esmaelian, M. Tavana, D. Di Caprio, and R. Ansari, “A multiple correspondence analysis model for evaluating technology foresight methods,” Technological Forecasting and Social Change, vol. 125, pp. 188–205, 2017, doi: 10.1016/j.techfore.2017.07.022.
Esmaelian, Majid, et al. “A Multiple Correspondence Analysis Model for Evaluating Technology Foresight Methods.” Technological Forecasting and Social Change, vol. 125, Elsevier BV, 2017, pp. 188–205, doi:10.1016/j.techfore.2017.07.022.
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