Monitoring the curing process of adhesive bonds using selective excitation of guided ultrasonic waves
H. Zeipert, T. Nellius, N. Schönlau, M. Wippermann, L. Claes, M. Nicolai, J. Prager, B. Henning, in: 2025 International Congress on Ultrasonics, AMA Service GmbH, 2025, pp. 207--210.
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Conference Paper
| Published
| English
Author
Zeipert, HenningLibreCat;
Nellius, Tom;
Schönlau, Nikolas;
Wippermann, MareenLibreCat;
Claes, LeanderLibreCat 
;
Nicolai, Marcel;
Prager, Jens;
Henning, BerndLibreCat
;
Nicolai, Marcel;
Prager, Jens;
Henning, BerndLibreCatPublishing Year
Proceedings Title
2025 International Congress on Ultrasonics
Page
207--210
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Cite this
Zeipert H, Nellius T, Schönlau N, et al. Monitoring the curing process of adhesive bonds using selective excitation of guided ultrasonic waves. In: 2025 International Congress on Ultrasonics. AMA Service GmbH; 2025:207--210. doi:10.5162/ultrasonic2025/c6-a3
Zeipert, H., Nellius, T., Schönlau, N., Wippermann, M., Claes, L., Nicolai, M., Prager, J., & Henning, B. (2025). Monitoring the curing process of adhesive bonds using selective excitation of guided ultrasonic waves. 2025 International Congress on Ultrasonics, 207--210. https://doi.org/10.5162/ultrasonic2025/c6-a3
@inproceedings{Zeipert_Nellius_Schönlau_Wippermann_Claes_Nicolai_Prager_Henning_2025, title={Monitoring the curing process of adhesive bonds using selective excitation of guided ultrasonic waves}, DOI={10.5162/ultrasonic2025/c6-a3}, booktitle={2025 International Congress on Ultrasonics}, publisher={AMA Service GmbH}, author={Zeipert, Henning and Nellius, Tom and Schönlau, Nikolas and Wippermann, Mareen and Claes, Leander and Nicolai, Marcel and Prager, Jens and Henning, Bernd}, year={2025}, pages={207--210} }
Zeipert, Henning, Tom Nellius, Nikolas Schönlau, Mareen Wippermann, Leander Claes, Marcel Nicolai, Jens Prager, and Bernd Henning. “Monitoring the Curing Process of Adhesive Bonds Using Selective Excitation of Guided Ultrasonic Waves.” In 2025 International Congress on Ultrasonics, 207--210. AMA Service GmbH, 2025. https://doi.org/10.5162/ultrasonic2025/c6-a3.
H. Zeipert et al., “Monitoring the curing process of adhesive bonds using selective excitation of guided ultrasonic waves,” in 2025 International Congress on Ultrasonics, 2025, pp. 207--210, doi: 10.5162/ultrasonic2025/c6-a3.
Zeipert, Henning, et al. “Monitoring the Curing Process of Adhesive Bonds Using Selective Excitation of Guided Ultrasonic Waves.” 2025 International Congress on Ultrasonics, AMA Service GmbH, 2025, pp. 207--210, doi:10.5162/ultrasonic2025/c6-a3.
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