Plasmonic modulators: bringing a new light to silicon

C. Hoessbacher, B. Baeuerle, N. Del Medico, E. De Leo, N.A. Güsken, W. Heni, A. Langenbach, V. Tedaldi, IET Conference Proceedings 2023 (2024) 1606–1608.

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Journal Article | Published | English
Author
Hoessbacher, C.; Baeuerle, B.; Del Medico, N.; De Leo, E.; Güsken, Nicholas AlexanderLibreCat ; Heni, W.; Langenbach, A.; Tedaldi, V.
Publishing Year
Journal Title
IET Conference Proceedings
Volume
2023
Issue
34
Page
1606-1608
ISSN
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Hoessbacher C, Baeuerle B, Del Medico N, et al. Plasmonic modulators: bringing a new light to silicon. IET Conference Proceedings. 2024;2023(34):1606-1608. doi:10.1049/icp.2023.2642
Hoessbacher, C., Baeuerle, B., Del Medico, N., De Leo, E., Güsken, N. A., Heni, W., Langenbach, A., & Tedaldi, V. (2024). Plasmonic modulators: bringing a new light to silicon. IET Conference Proceedings, 2023(34), 1606–1608. https://doi.org/10.1049/icp.2023.2642
@article{Hoessbacher_Baeuerle_Del Medico_De Leo_Güsken_Heni_Langenbach_Tedaldi_2024, title={Plasmonic modulators: bringing a new light to silicon}, volume={2023}, DOI={10.1049/icp.2023.2642}, number={34}, journal={IET Conference Proceedings}, publisher={Institution of Engineering and Technology (IET)}, author={Hoessbacher, C. and Baeuerle, B. and Del Medico, N. and De Leo, E. and Güsken, Nicholas Alexander and Heni, W. and Langenbach, A. and Tedaldi, V.}, year={2024}, pages={1606–1608} }
Hoessbacher, C., B. Baeuerle, N. Del Medico, E. De Leo, Nicholas Alexander Güsken, W. Heni, A. Langenbach, and V. Tedaldi. “Plasmonic Modulators: Bringing a New Light to Silicon.” IET Conference Proceedings 2023, no. 34 (2024): 1606–8. https://doi.org/10.1049/icp.2023.2642.
C. Hoessbacher et al., “Plasmonic modulators: bringing a new light to silicon,” IET Conference Proceedings, vol. 2023, no. 34, pp. 1606–1608, 2024, doi: 10.1049/icp.2023.2642.
Hoessbacher, C., et al. “Plasmonic Modulators: Bringing a New Light to Silicon.” IET Conference Proceedings, vol. 2023, no. 34, Institution of Engineering and Technology (IET), 2024, pp. 1606–08, doi:10.1049/icp.2023.2642.

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