Three-dimensional particle localization with common-path digital holographic microscopy

K. Neutsch, M.R. Hofmann, N.C. Gerhardt, L. Schnitzler, M.J. Tranelis, in: Practical Holography XXXIII: Displays, Materials, and Applications, 2019.

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Neutsch, Krisztian; Hofmann, Martin R.; Gerhardt, Nils ChristopherLibreCat ; Schnitzler, Lena; Tranelis, Marlon J.
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Practical Holography XXXIII: Displays, Materials, and Applications
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Neutsch K, Hofmann MR, Gerhardt NC, Schnitzler L, Tranelis MJ. Three-dimensional particle localization with common-path digital holographic microscopy. In: Practical Holography XXXIII: Displays, Materials, and Applications. ; 2019. doi:10.1117/12.2509448
Neutsch, K., Hofmann, M. R., Gerhardt, N. C., Schnitzler, L., & Tranelis, M. J. (2019). Three-dimensional particle localization with common-path digital holographic microscopy. Practical Holography XXXIII: Displays, Materials, and Applications. https://doi.org/10.1117/12.2509448
@inproceedings{Neutsch_Hofmann_Gerhardt_Schnitzler_Tranelis_2019, title={Three-dimensional particle localization with common-path digital holographic microscopy}, DOI={10.1117/12.2509448}, booktitle={Practical Holography XXXIII: Displays, Materials, and Applications}, author={Neutsch, Krisztian and Hofmann, Martin R. and Gerhardt, Nils Christopher and Schnitzler, Lena and Tranelis, Marlon J.}, year={2019} }
Neutsch, Krisztian, Martin R. Hofmann, Nils Christopher Gerhardt, Lena Schnitzler, and Marlon J. Tranelis. “Three-Dimensional Particle Localization with Common-Path Digital Holographic Microscopy.” In Practical Holography XXXIII: Displays, Materials, and Applications, 2019. https://doi.org/10.1117/12.2509448.
K. Neutsch, M. R. Hofmann, N. C. Gerhardt, L. Schnitzler, and M. J. Tranelis, “Three-dimensional particle localization with common-path digital holographic microscopy,” 2019, doi: 10.1117/12.2509448.
Neutsch, Krisztian, et al. “Three-Dimensional Particle Localization with Common-Path Digital Holographic Microscopy.” Practical Holography XXXIII: Displays, Materials, and Applications, 2019, doi:10.1117/12.2509448.

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