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21 Publications
2020 | Conference Paper | LibreCat-ID: 17355
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
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