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13 Publications
2014 | Conference Paper | LibreCat-ID: 9895
Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the 47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US; 2014:289-294.
LibreCat
2014 | Conference Paper | LibreCat-ID: 9896
Unger A, Sextro W, Althoff S, et al. Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding. In: Proceedings of 8th International Conference on Integrated Power Electronic Systems. Vol 141. ; 2014:175-180.
LibreCat
2013 | Conference Paper | LibreCat-ID: 9799
Eichwald P, Sextro W, Althoff S, et al. Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding. In: 15th Electronics Packaging Technology Conference. ; 2013. doi:10.1109/EPTC.2013.6745803
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