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13 Publications


2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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2014 | Conference Paper | LibreCat-ID: 9896
A. Unger et al., “Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding,” in Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, vol. 141, pp. 175–180.
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2013 | Conference Paper | LibreCat-ID: 9799
P. Eichwald et al., “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding,” in 15th Electronics Packaging Technology Conference, 2013.
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