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13 Publications
2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–94.
LibreCat
2014 | Conference Paper | LibreCat-ID: 9896
Unger, Andreas, et al. “Data-Driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.” Proceedings of 8th International Conference on Integrated Power Electronic Systems, vol. 141, 2014, pp. 175–80.
LibreCat
2013 | Conference Paper | LibreCat-ID: 9799
Eichwald, Paul, et al. “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding.” 15th Electronics Packaging Technology Conference, 2013, doi:10.1109/EPTC.2013.6745803.
LibreCat
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