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13 Publications
2014 | Conference Paper | LibreCat-ID: 9895
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
LibreCat
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
2014 | Conference Paper | LibreCat-ID: 9896
Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding
A. Unger, W. Sextro, S. Althoff, T. Meyer, M. Brökelmann, K. Neumann, R.F. Reimann, K. Guth, D. Bolowski, in: Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, pp. 175–180.
LibreCat
A. Unger, W. Sextro, S. Althoff, T. Meyer, M. Brökelmann, K. Neumann, R.F. Reimann, K. Guth, D. Bolowski, in: Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, pp. 175–180.
2013 | Conference Paper | LibreCat-ID: 9799
Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding
P. Eichwald, W. Sextro, S. Althoff, F. Eacock, M. Schnietz, K. Guth, M. Brökelmann, in: 15th Electronics Packaging Technology Conference, 2013.
LibreCat
| DOI
P. Eichwald, W. Sextro, S. Althoff, F. Eacock, M. Schnietz, K. Guth, M. Brökelmann, in: 15th Electronics Packaging Technology Conference, 2013.