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5 Publications
2019 | Journal Article | LibreCat-ID: 10334
Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662. https://doi.org/10.1016/j.sna.2019.04.025
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| DOI
2018 | Conference Paper | LibreCat-ID: 9992
Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
LibreCat
2018 | Conference Paper | LibreCat-ID: 9997
Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., & Hunstig, M. (2018). Effects of different working frequencies on the joint formation in copper wire bonding. In CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018) (pp. 230–235). Stuttgart, Germany.
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2017 | Journal Article | LibreCat-ID: 9973
Eichwald, P., Althoff, S., Schemmel, R., Sextro, W., Unger, A., Brökelmann, M., & Hunstig, M. (2017). Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. IMAPSource, Vol. 2017, No. 1.
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