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302 Publications


2015 | Conference Paper | LibreCat-ID: 9949
T. Meyer, T. Kaul, and W. Sextro, “Advantages of reliability-adaptive system operation for maintenance planning,” in Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp. 940–945.
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2015 | Conference Paper | LibreCat-ID: 9947
J. K. Kimotho and W. Sextro, “Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics,” in Annual Conference of the Prognostics and Health Management Society 2015, 2015, vol. 6.
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2014 | Dissertation | LibreCat-ID: 9875
M. Hunstig, Konzeption, Ansteuerung und Eigenschaften schneller piezoelektrischer Trägheitsmotoren. Shaker, 2014.
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2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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2014 | Conference Paper | LibreCat-ID: 9896
A. Unger et al., “Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding,” in Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, vol. 141, pp. 175–180.
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2014 | Conference Paper | LibreCat-ID: 9871
P. Eichwald et al., “Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
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2014 | Conference Paper | LibreCat-ID: 9887
J. Neuhaus and W. Sextro, “Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact Elements,” in Proceedings of the 5th International Conference on Computational Methods, 2014.
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2014 | Conference Paper | LibreCat-ID: 9870
F. Eacock et al., “Microstructural investigations of aluminum and copper wire bonds,” in Proceedings of the 47th International Symposium on Microelectronics, 2014.
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2014 | Conference Paper | LibreCat-ID: 9868
S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “Improving the bond quality of copper wire bonds using a friction model approach,” in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
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2014 | Journal Article | LibreCat-ID: 9874
T. Hemsel, P. Bornmann, T. Morita, C. Sondermann-Wölke, and W. Sextro, “Reliability analysis of ultrasonic power transducers,” Archive of Applied Mechanics, pp. 1–7, 2014.
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