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302 Publications
2015 | Conference Paper | LibreCat-ID: 9949
Advantages of reliability-adaptive system operation for maintenance planning
T. Meyer, T. Kaul, W. Sextro, in: Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp. 940–945.
LibreCat
| DOI
T. Meyer, T. Kaul, W. Sextro, in: Proceedings of the 9th IFAC Symposium on Fault Detection, Supervision and Safety for Technical Processes, 2015, pp. 940–945.
2015 | Conference Paper | LibreCat-ID: 9947
Comparison and ensemble of temperature-based and vibration-based methods for machinery prognostics
J.K. Kimotho, W. Sextro, in: Annual Conference of the Prognostics and Health Management Society 2015, 2015.
LibreCat
J.K. Kimotho, W. Sextro, in: Annual Conference of the Prognostics and Health Management Society 2015, 2015.
2014 | Dissertation | LibreCat-ID: 9875
Konzeption, Ansteuerung und Eigenschaften schneller piezoelektrischer Trägheitsmotoren
M. Hunstig, Konzeption, Ansteuerung Und Eigenschaften Schneller Piezoelektrischer Trägheitsmotoren, Shaker, 2014.
LibreCat
M. Hunstig, Konzeption, Ansteuerung Und Eigenschaften Schneller Piezoelektrischer Trägheitsmotoren, Shaker, 2014.
2014 | Conference Paper | LibreCat-ID: 9895
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
LibreCat
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
2014 | Conference Paper | LibreCat-ID: 9896
Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding
A. Unger, W. Sextro, S. Althoff, T. Meyer, M. Brökelmann, K. Neumann, R.F. Reimann, K. Guth, D. Bolowski, in: Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, pp. 175–180.
LibreCat
A. Unger, W. Sextro, S. Althoff, T. Meyer, M. Brökelmann, K. Neumann, R.F. Reimann, K. Guth, D. Bolowski, in: Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, pp. 175–180.
2014 | Conference Paper | LibreCat-ID: 9871
Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding
P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
LibreCat
| DOI
P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
2014 | Conference Paper | LibreCat-ID: 9887
Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact Elements
J. Neuhaus, W. Sextro, in: G.R. Liu, Z.W. Guan (Eds.), Proceedings of the 5th International Conference on Computational Methods, ScienTech Publisher, 2014.
LibreCat
J. Neuhaus, W. Sextro, in: G.R. Liu, Z.W. Guan (Eds.), Proceedings of the 5th International Conference on Computational Methods, ScienTech Publisher, 2014.
2014 | Conference Paper | LibreCat-ID: 9870
Microstructural investigations of aluminum and copper wire bonds
F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.
LibreCat
| DOI
F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.
2014 | Conference Paper | LibreCat-ID: 9868
Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat
| DOI
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
2014 | Journal Article | LibreCat-ID: 9874
Reliability analysis of ultrasonic power transducers
T. Hemsel, P. Bornmann, T. Morita, C. Sondermann-Wölke, W. Sextro, Archive of Applied Mechanics (2014) 1–7.
LibreCat
| DOI
T. Hemsel, P. Bornmann, T. Morita, C. Sondermann-Wölke, W. Sextro, Archive of Applied Mechanics (2014) 1–7.