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135 Publications
2024 | Journal Article | LibreCat-ID: 51518
O. K. Aimiyekagbon, A. Bender, T. Hemsel, and W. Sextro, “Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions,” Electronics, vol. 13, no. 3, Art. no. 521, 2024, doi: 10.3390/electronics13030521.
LibreCat
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2023 | Conference Abstract | LibreCat-ID: 47234
B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), Dresden, 2023.
LibreCat
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2023 | Conference Abstract | LibreCat-ID: 47235
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), Dresden, 2023.
LibreCat
| Files available
2023 | Conference Abstract | LibreCat-ID: 51117
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea, 2023.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51118
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Incheon, Korea, 2023.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51119
C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.
LibreCat
2022 | Book Chapter | LibreCat-ID: 33500
T. Hemsel and J. Twiefel, “Piezoelectric Ultrasonic Power Transducers,” in Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.
LibreCat
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2022 | Conference Paper | LibreCat-ID: 30371
O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.
LibreCat
2022 | Conference Paper | LibreCat-ID: 34104
C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478.
LibreCat
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2022 | Report | LibreCat-ID: 52045
C. Scheidemann, T. Hemsel, and W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022.
LibreCat
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