Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process
C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.
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Conference Abstract
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Conference
International Conference on Functional Materials & Devices 2023 (ICFMD 2023)
Conference Location
Jeju, Korea
Conference Date
2023-10-31 – 2023-11-03
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Scheidemann C, Hagedorn OEC, Hemsel T, Sextro W. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. In: ; 2023.
Scheidemann, C., Hagedorn, O. E. C., Hemsel, T., & Sextro, W. (2023). Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea.
@inproceedings{Scheidemann_Hagedorn_Hemsel_Sextro_2023, title={Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process}, author={Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel, Tobias and Sextro, Walter}, year={2023} }
Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” 2023.
C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.
Scheidemann, Claus, et al. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. 2023.
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