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17 Publications
2016 | Conference Paper | LibreCat-ID: 9959
Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91
LibreCat
| DOI
2016 | Conference Paper | LibreCat-ID: 9966
Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9868
Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9870
Eacock F, Schaper M, Althoff S, et al. Microstructural investigations of aluminum and copper wire bonds. In: Proceedings of the 47th International Symposium on Microelectronics. ; 2014. doi:10.4071/isom-THP32
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9871
Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In: Proceedings of the 47th International Symposium on Microelectronics. ; 2014:856-861. doi:10.4071/isom-THP34
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9895
Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the 47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US; 2014:289-294.
LibreCat
2010 | Journal Article | LibreCat-ID: 4548
Herres-Pawlis S, Berth G, Wiedemeier V, Schmidt L, Zrenner A, Warnecke H-J. Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]. Journal of Luminescence. 2010;130(10):1958-1962. doi:10.1016/j.jlumin.2010.05.012
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| DOI