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12 Publications
2023 | Dissertation | LibreCat-ID: 41971
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, vol. 15. Shaker, 2023.
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2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
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| DOI
2018 | Conference Paper | LibreCat-ID: 9999
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
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2018 | Journal Article | LibreCat-ID: 13186
T. Rösener, A. Hoffmann, and S. Herres-Pawlis, “Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility,” European Journal of Inorganic Chemistry, vol. 2018, no. 27, pp. 3164–3175, 2018.
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| DOI
2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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