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12 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol 15. Shaker; 2023.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
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2018 | Conference Paper | LibreCat-ID: 9999
Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572
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2018 | Journal Article | LibreCat-ID: 13186
Rösener T, Hoffmann A, Herres-Pawlis S. Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility. European Journal of Inorganic Chemistry. 2018;2018(27):3164-3175. doi:10.1002/ejic.201800511
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2017 | Journal Article | LibreCat-ID: 13187
Oppermann A, Laurini L, Etscheidt F, et al. Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer. Chemical Engineering \& Technology. 2017;40(8):1475-1483. doi:10.1002/ceat.201600691
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91
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2016 | Conference Paper | LibreCat-ID: 9966
Meyer T, Unger A, Althoff S, et al. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:622-628. doi:10.1109/ECTC.2016.215
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500
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2014 | Conference Paper | LibreCat-ID: 9870
Eacock F, Schaper M, Althoff S, et al. Microstructural investigations of aluminum and copper wire bonds. In: Proceedings of the 47th International Symposium on Microelectronics. ; 2014. doi:10.4071/isom-THP32
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2014 | Conference Paper | LibreCat-ID: 9871
Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding. In: Proceedings of the 47th International Symposium on Microelectronics. ; 2014:856-861. doi:10.4071/isom-THP34
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2014 | Conference Paper | LibreCat-ID: 9895
Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the 47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US; 2014:289-294.
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2010 | Journal Article | LibreCat-ID: 4548
Herres-Pawlis S, Berth G, Wiedemeier V, Schmidt L, Zrenner A, Warnecke H-J. Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]. Journal of Luminescence. 2010;130(10):1958-1962. doi:10.1016/j.jlumin.2010.05.012
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