Please note that LibreCat no longer supports Internet Explorer versions 8 or 9 (or earlier).
We recommend upgrading to the latest Internet Explorer, Google Chrome, or Firefox.
5 Publications
2025 | Journal Article | LibreCat-ID: 58473
@article{Osberghaus_Botzen_Kesternich_2025, title={The intention-behavior gap in climate change adaptation: Evidence from longitudinal survey data}, journal={Ecological Economics }, author={Osberghaus, Daniel and Botzen, Wouter and Kesternich, Martin}, year={2025} }
LibreCat
2025 | Dissertation | LibreCat-ID: 59239
@book{Grabo_2025, place={Paderborn}, title={Modeling and optimization of energy system components equipped with phase change materials}, DOI={10.17619/UNIPB/1-2199}, author={Grabo, Matti}, year={2025} }
LibreCat
| DOI
2024 | Conference Paper | LibreCat-ID: 49430
@inproceedings{Kaiser_Höschen_Pfeffer_Merten_Meyer_Marten_Rockicki_Höppel_Tröster_2024, title={The new TISTRAQ process: Solution treatment with rapid quenching and annealing for Ti-6Al-4V sheet metal part forming - investigation on heat transfer coefficient and influence on cooling rates}, DOI={doi.org/10.7490/f1000research.1119929.1}, booktitle={IOM3. Chapter 14: Forming, Machining & Joining [version 1; not peer reviewed]}, author={Kaiser, Maximilian Alexander and Höschen, Fabian and Pfeffer, Nina and Merten, Mathias and Meyer, Thomas and Marten, Thorsten and Rockicki, Pawel and Höppel, Heinz Werner and Tröster, Thomas}, year={2024} }
LibreCat
| DOI
2022 | Conference Abstract | LibreCat-ID: 49433
@inproceedings{Kaiser_Rockicki_Höschen_Wesendahl_Konrad_Meyer_Marten_Tröster_2022, title={ Heat transfer coefficient investigation for hot die quenching process of Ti-6Al-4V alloy}, author={Kaiser, Maximilian Alexander and Rockicki, Pawel and Höschen, Fabian and Wesendahl, Jan-Niklas and Konrad, Stefan and Meyer, Thomas and Marten, Thorsten and Tröster, Thomas}, year={2022} }
LibreCat
2014 | Conference Paper | LibreCat-ID: 9868
@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }
LibreCat
| DOI