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1 Publication
2014 | Conference Paper | LibreCat-ID: 9870
Eacock , F., Schaper, M., Althoff, S., Unger, A., Eichwald, P., Hengsbach, F., … Guth, K. (2014). Microstructural investigations of aluminum and copper wire bonds. In Proceedings of the 47th International Symposium on Microelectronics. https://doi.org/10.4071/isom-THP32
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