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3 Publications
2016 | Conference Paper | LibreCat-ID: 9959
Eacock F, Unger A, Eichwald P, et al. Effect of different oxide layers on the ultrasonic copper wire bond process. In: IEEE 66th Electronic Components and Technology Conference. ; 2016:2111-2118. doi:10.1109/ECTC.2016.91
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| DOI
2014 | Conference Paper | LibreCat-ID: 9868
Althoff S, Neuhaus J, Hemsel T, Sextro W. Improving the bond quality of copper wire bonds using a friction model approach. In: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. ; 2014:1549-1555. doi:10.1109/ECTC.2014.6897500
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9895
Unger A, Sextro W, Althoff S, et al. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds. In: Proceedings of the 47th International Symposium on Microelectronics (IMAPS). San Diego, CA, US; 2014:289-294.
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