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1 Publication
2013 | Conference Paper | LibreCat-ID: 9797
Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling wire bonding. In: IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA; 2013. doi:10.4071/isom-2013-TA67
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