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1 Publication
2013 | Conference Paper | LibreCat-ID: 9797
Althoff, S., Neuhaus, J., Hemsel, T., & Sextro, W. (2013). A friction based approach for modeling wire bonding. In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA. https://doi.org/10.4071/isom-2013-TA67
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