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1 Publication
2018 | Conference Paper | LibreCat-ID: 9992
@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }
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