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1 Publication
2014 | Conference Paper | LibreCat-ID: 9871
@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding}, DOI={10.4071/isom-THP34}, booktitle={Proceedings of the 47th International Symposium on Microelectronics}, author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861} }
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