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12 Publications
2014 | Conference Paper | LibreCat-ID: 9895
@inproceedings{Unger_Sextro_Althoff_Eichwald_Meyer_Eacock_Brökelmann_2014, place={San Diego, CA, US}, title={Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds}, booktitle={Proceedings of the 47th International Symposium on Microelectronics (IMAPS)}, author={Unger, Andreas and Sextro, Walter and Althoff, Simon and Eichwald, Paul and Meyer, Tobias and Eacock, Florian and Brökelmann, Michael}, year={2014}, pages={289–294} }
LibreCat
2013 | Conference Paper | LibreCat-ID: 9797
@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida), USA}, title={A friction based approach for modeling wire bonding}, DOI={10.4071/isom-2013-TA67}, booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }
LibreCat
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