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143 Publications


2025 | Journal Article | LibreCat-ID: 58510 | OA
Lead-Free Ceramics in Prestressed Ultrasonic Transducers
C. Scheidemann, P. Bornmann, W. Littmann, T. Hemsel, Actuators 14 (2025).
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2025 | Conference Abstract | LibreCat-ID: 61755 LibreCat
 

2025 | Conference Abstract | LibreCat-ID: 61757 LibreCat
 

2025 | Conference Paper | LibreCat-ID: 62300
Estimation of third order elastic constants of piezoceramics using DC biased impedance measurements
L. Claes, J. Hölscher, O. Friesen, C. Scheidemann, T. Hemsel, B. Henning, in: 2025 International Congress on Ultrasonics, AMA Service GmbH, Paderborn, 2025, pp. 142–145.
LibreCat | DOI
 

2025 | Conference Paper | LibreCat-ID: 62299
Sensitivity Analysis and Material Parameter Estimation of a Pre-Stressed Langevin Transducer
O. Friesen, C. Scheidemann, L. Claes, T. Hemsel, B. Henning, in: 2025 International Congress on Ultrasonics, AMA Service GmbH, Paderborn, 2025, pp. 138–141.
LibreCat | DOI
 

2024 | Journal Article | LibreCat-ID: 51518
Diagnostics of Piezoelectric Bending Actuators Subjected to Varying Operating Conditions
O.K. Aimiyekagbon, A. Bender, T. Hemsel, W. Sextro, Electronics 13 (2024).
LibreCat | DOI
 

2024 | Conference Paper | LibreCat-ID: 56834 | OA
Estimation of temperature-dependent piezoelectric material parameters using ring-shaped specimens
O. Friesen, L. Claes, C. Scheidemann, N. Feldmann, T. Hemsel, B. Henning, in: 2023 International Congress on Ultrasonics, Beijing, China, IOP Publishing, 2024, p. 012125.
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2024 | Journal Article | LibreCat-ID: 57467
The Influence of Ultrasonic Irradiation of a 316L Weld Pool Produced by DED on the Mechanical Properties of the Produced Component
D. Lehnert, C. Bödger, P. Pabel, C. Scheidemann, T. Hemsel, S. Gnaase, D. Kostka, T. Tröster, Crystals 14 (2024).
LibreCat | Files available | DOI
 

2024 | Conference Abstract | LibreCat-ID: 61756 LibreCat
 

2023 | Conference Abstract | LibreCat-ID: 51117
Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
LibreCat
 

2023 | Conference Abstract | LibreCat-ID: 51118
Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, W. Sextro, in: 2023.
LibreCat
 

2023 | Conference Abstract | LibreCat-ID: 51119 LibreCat
 

2023 | Conference Abstract | LibreCat-ID: 47234
Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells
B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), 2023.
LibreCat | Files available
 

2023 | Conference Abstract | LibreCat-ID: 47235
Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, M. Getzlaff, in: Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), 2023.
LibreCat | Files available
 

2022 | Book Chapter | LibreCat-ID: 33500
Piezoelectric Ultrasonic Power Transducers
T. Hemsel, J. Twiefel, in: Reference Module in Materials Science and Materials Engineering, Elsevier, 2022.
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2022 | Report | LibreCat-ID: 52045
Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen
C. Scheidemann, T. Hemsel, W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen, LibreCat University, 2022.
LibreCat | Files available | DOI
 

2022 | Conference Paper | LibreCat-ID: 30371
Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding
O.E.C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, W. Sextro, in: CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, Berlin, 2022, pp. 138–143.
LibreCat
 

2022 | Conference Paper | LibreCat-ID: 34104
Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding
C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.
LibreCat | DOI
 

2021 | Journal Article | LibreCat-ID: 21436
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
LibreCat | DOI
 

2020 | Conference Paper | LibreCat-ID: 17355
Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, W. Sextro, in: CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
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