A Fault Tolerant Mechanism for Handling Permanent and Transient Failures in a Network on Chip

M. Ali, M. Welzl, S. Hessler, S. Hellebrand, in: {4th International Conference on Information Technology: New Generations (ITNG’07)}, Las Vegas, Nevada, USA, 2007, pp. 1027–1032.

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Conference Paper | English
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{4th International Conference on Information Technology: New Generations (ITNG'07)}
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1027-1032
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Ali M, Welzl M, Hessler S, Hellebrand S. A Fault Tolerant Mechanism for Handling Permanent and Transient Failures in a Network on Chip. In: {4th International Conference on Information Technology: New Generations (ITNG’07)}. Las Vegas, Nevada, USA; 2007:1027-1032.
Ali, M., Welzl, M., Hessler, S., & Hellebrand, S. (2007). A Fault Tolerant Mechanism for Handling Permanent and Transient Failures in a Network on Chip. In {4th International Conference on Information Technology: New Generations (ITNG’07)} (pp. 1027–1032). Las Vegas, Nevada, USA.
@inproceedings{Ali_Welzl_Hessler_Hellebrand_2007, place={Las Vegas, Nevada, USA}, title={A Fault Tolerant Mechanism for Handling Permanent and Transient Failures in a Network on Chip}, booktitle={{4th International Conference on Information Technology: New Generations (ITNG’07)}}, author={Ali, Muhammad and Welzl, Michael and Hessler, Sven and Hellebrand, Sybille}, year={2007}, pages={1027–1032} }
Ali, Muhammad, Michael Welzl, Sven Hessler, and Sybille Hellebrand. “A Fault Tolerant Mechanism for Handling Permanent and Transient Failures in a Network on Chip.” In {4th International Conference on Information Technology: New Generations (ITNG’07)}, 1027–32. Las Vegas, Nevada, USA, 2007.
M. Ali, M. Welzl, S. Hessler, and S. Hellebrand, “A Fault Tolerant Mechanism for Handling Permanent and Transient Failures in a Network on Chip,” in {4th International Conference on Information Technology: New Generations (ITNG’07)}, 2007, pp. 1027–1032.
Ali, Muhammad, et al. “A Fault Tolerant Mechanism for Handling Permanent and Transient Failures in a Network on Chip.” {4th International Conference on Information Technology: New Generations (ITNG’07)}, 2007, pp. 1027–32.

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