Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding

R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 000509–000514.

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<jats:p> Ultrasonic joining is a common industrial process. To build electrical connections in the electronics industry, uni-axial and torsional ultrasonic vibration have been used to join different types of workpieces for decades. Many influencing factors like ultrasonic power, bond normal force, bond duration and frequency are known to have a high impact on bond quality and reliability. Multi-dimensional bonding has been investigated in the past to increase ultrasonic power and consequently bond strength. This contribution is focused on the comparison of circular, multi-frequency planar and uniaxial vibration trajectories used for ultrasonic bonding of copper pins on copper substrate. Bond quality was analyzed by shear tests, scanning acoustic microscopy and interface cross-sections. </jats:p>
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Proceedings Title
International Symposium on Microelectronics
Page
000509-000514
Conference
International Symposium on Microelectronics
Conference Location
Boston
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Schemmel R, Eacock F, Dymel C, et al. Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. In: International Symposium on Microelectronics. ; 2019:000509-000514. doi:10.4071/2380-4505-2019.1.000509
Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. In International Symposium on Microelectronics (pp. 000509–000514). Boston. https://doi.org/10.4071/2380-4505-2019.1.000509
@inproceedings{Schemmel_Eacock_Dymel_Hemsel_Hunstig_Brökelmann_Sextro_2019, title={Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding}, DOI={10.4071/2380-4505-2019.1.000509}, booktitle={International Symposium on Microelectronics}, author={Schemmel, Reinhard and Eacock, Florian and Dymel, Collin and Hemsel, Tobias and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={000509–000514} }
Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In International Symposium on Microelectronics, 000509–14, 2019. https://doi.org/10.4071/2380-4505-2019.1.000509.
R. Schemmel et al., “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,” in International Symposium on Microelectronics, Boston, 2019, pp. 000509–000514.
Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” International Symposium on Microelectronics, 2019, pp. 000509–14, doi:10.4071/2380-4505-2019.1.000509.
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