Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes
D. Teutenberg, G. Meschut, O. Hahn, M. Schlimmer, P. Kuehlmeyer, A. Matzenmiller, Journal of The Adhesion Society of Japan (2015) 227–228.
Download
No fulltext has been uploaded.
Journal Article
| Published
| English
Author
Teutenberg, DominikLibreCat;
Meschut, GersonLibreCat 
;
Hahn, O;
Schlimmer, M;
Kuehlmeyer, P;
Matzenmiller, A
;
Hahn, O;
Schlimmer, M;
Kuehlmeyer, P;
Matzenmiller, APublishing Year
Journal Title
Journal of The Adhesion Society of Japan
Page
227-228
LibreCat-ID
Cite this
Teutenberg D, Meschut G, Hahn O, Schlimmer M, Kuehlmeyer P, Matzenmiller A. Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes. Journal of The Adhesion Society of Japan. 2015:227-228. doi:10.11618/adhesion.51.227
Teutenberg, D., Meschut, G., Hahn, O., Schlimmer, M., Kuehlmeyer, P., & Matzenmiller, A. (2015). Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes. Journal of The Adhesion Society of Japan, 227–228. https://doi.org/10.11618/adhesion.51.227
@article{Teutenberg_Meschut_Hahn_Schlimmer_Kuehlmeyer_Matzenmiller_2015, title={Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes}, DOI={10.11618/adhesion.51.227}, journal={Journal of The Adhesion Society of Japan}, author={Teutenberg, Dominik and Meschut, Gerson and Hahn, O and Schlimmer, M and Kuehlmeyer, P and Matzenmiller, A}, year={2015}, pages={227–228} }
Teutenberg, Dominik, Gerson Meschut, O Hahn, M Schlimmer, P Kuehlmeyer, and A Matzenmiller. “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-Curing Processes.” Journal of The Adhesion Society of Japan, 2015, 227–28. https://doi.org/10.11618/adhesion.51.227.
D. Teutenberg, G. Meschut, O. Hahn, M. Schlimmer, P. Kuehlmeyer, and A. Matzenmiller, “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes,” Journal of The Adhesion Society of Japan, pp. 227–228, 2015.
Teutenberg, Dominik, et al. “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-Curing Processes.” Journal of The Adhesion Society of Japan, 2015, pp. 227–28, doi:10.11618/adhesion.51.227.
Google Scholar