Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes

D. Teutenberg, G. Meschut, O. Hahn, M. Schlimmer, P. Kuehlmeyer, A. Matzenmiller, Journal of The Adhesion Society of Japan (2015) 227–228.

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Journal Article | Published | English
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Journal of The Adhesion Society of Japan
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227-228
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Teutenberg D, Meschut G, Hahn O, Schlimmer M, Kuehlmeyer P, Matzenmiller A. Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes. Journal of The Adhesion Society of Japan. 2015:227-228. doi:10.11618/adhesion.51.227
Teutenberg, D., Meschut, G., Hahn, O., Schlimmer, M., Kuehlmeyer, P., & Matzenmiller, A. (2015). Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes. Journal of The Adhesion Society of Japan, 227–228. https://doi.org/10.11618/adhesion.51.227
@article{Teutenberg_Meschut_Hahn_Schlimmer_Kuehlmeyer_Matzenmiller_2015, title={Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes}, DOI={10.11618/adhesion.51.227}, journal={Journal of The Adhesion Society of Japan}, author={Teutenberg, D and Meschut, G and Hahn, O and Schlimmer, M and Kuehlmeyer, P and Matzenmiller, A}, year={2015}, pages={227–228} }
Teutenberg, D, G Meschut, O Hahn, M Schlimmer, P Kuehlmeyer, and A Matzenmiller. “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-Curing Processes.” Journal of The Adhesion Society of Japan, 2015, 227–28. https://doi.org/10.11618/adhesion.51.227.
D. Teutenberg, G. Meschut, O. Hahn, M. Schlimmer, P. Kuehlmeyer, and A. Matzenmiller, “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-curing Processes,” Journal of The Adhesion Society of Japan, pp. 227–228, 2015.
Teutenberg, D., et al. “Influence of Stress and Temperature on AdhesivelyBonded Joints in and After Heat-Curing Processes.” Journal of The Adhesion Society of Japan, 2015, pp. 227–28, doi:10.11618/adhesion.51.227.

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