Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation

C. Hoppe, C. Ebbert, M. Voigt, H.C. Schmidt, D. Rodman, W. Homberg, H.J. Maier, G. Grundmeier, ADVANCED ENGINEERING MATERIALS 18 (2016) 1066–1074.

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Journal Article | Published | English
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Abstract
Interface modification based on ultra-thin mercapto-propyl(trimethoxy) silane (MPTMS) films is shown to promote joining of copper and aluminum by plastic deformation followed by a heat treatment. The surface morphology and the surface chemistry of the metal substrates were analyzed by means of FE-SEM, XPS, and FT-IRRAS. The spectroscopic data show that the MPTMS film is crosslinked via Si-O-Si bonds and that stable Cu-S and Si-O-Al interfacial bonds are formed. The shear-force tests of the joints led to force displacement curves that are characteristic for a covalently bonded interface. Complementary cross sectional SEM and EDS analysis of the joint proved that a defect-free interface was formed without any measureable interdiffusion of metals across the interface or cracking of an oxide films.
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Journal Title
ADVANCED ENGINEERING MATERIALS
Volume
18
Issue
6
Page
1066-1074
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Hoppe C, Ebbert C, Voigt M, et al. Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation. ADVANCED ENGINEERING MATERIALS. 2016;18(6):1066-1074. doi:10.1002/adem.201500501
Hoppe, C., Ebbert, C., Voigt, M., Schmidt, H. C., Rodman, D., Homberg, W., … Grundmeier, G. (2016). Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation. ADVANCED ENGINEERING MATERIALS, 18(6), 1066–1074. https://doi.org/10.1002/adem.201500501
@article{Hoppe_Ebbert_Voigt_Schmidt_Rodman_Homberg_Maier_Grundmeier_2016, title={Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation}, volume={18}, DOI={10.1002/adem.201500501}, number={6}, journal={ADVANCED ENGINEERING MATERIALS}, author={Hoppe, Christian and Ebbert, Christoph and Voigt, Markus and Schmidt, Hans Christian and Rodman, Dmytro and Homberg, Werner and Maier, Hans Juergen and Grundmeier, Guido}, year={2016}, pages={1066–1074} }
Hoppe, Christian, Christoph Ebbert, Markus Voigt, Hans Christian Schmidt, Dmytro Rodman, Werner Homberg, Hans Juergen Maier, and Guido Grundmeier. “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation.” ADVANCED ENGINEERING MATERIALS 18, no. 6 (2016): 1066–74. https://doi.org/10.1002/adem.201500501.
C. Hoppe et al., “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation,” ADVANCED ENGINEERING MATERIALS, vol. 18, no. 6, pp. 1066–1074, 2016.
Hoppe, Christian, et al. “Molecular Engineering of Aluminum-Copper Interfaces for Joining by Plastic Deformation.” ADVANCED ENGINEERING MATERIALS, vol. 18, no. 6, 2016, pp. 1066–74, doi:10.1002/adem.201500501.

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