Ultra‐broadband Signal Processing by means of Electronic‐Photonic Integration
C. Scheytt, in: 10th Sino-German Joint Symposium on Opto- and Microelectronic Devices and Circuits (SODC 2018), IEEE, Germany/Aachen, 2018.
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10th Sino-German Joint Symposium on Opto- and Microelectronic Devices and Circuits (SODC 2018)
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Scheytt C. Ultra‐broadband Signal Processing by means of Electronic‐Photonic Integration. In: 10th Sino-German Joint Symposium on Opto- and Microelectronic Devices and Circuits (SODC 2018). IEEE; 2018.
Scheytt, C. (2018). Ultra‐broadband Signal Processing by means of Electronic‐Photonic Integration. 10th Sino-German Joint Symposium on Opto- and Microelectronic Devices and Circuits (SODC 2018).
@inproceedings{Scheytt_2018, place={Germany/Aachen}, title={Ultra‐broadband Signal Processing by means of Electronic‐Photonic Integration}, booktitle={10th Sino-German Joint Symposium on Opto- and Microelectronic Devices and Circuits (SODC 2018)}, publisher={IEEE}, author={Scheytt, Christoph}, year={2018} }
Scheytt, Christoph. “Ultra‐broadband Signal Processing by Means of Electronic‐Photonic Integration.” In 10th Sino-German Joint Symposium on Opto- and Microelectronic Devices and Circuits (SODC 2018). Germany/Aachen: IEEE, 2018.
C. Scheytt, “Ultra‐broadband Signal Processing by means of Electronic‐Photonic Integration,” 2018.
Scheytt, Christoph. “Ultra‐broadband Signal Processing by Means of Electronic‐Photonic Integration.” 10th Sino-German Joint Symposium on Opto- and Microelectronic Devices and Circuits (SODC 2018), IEEE, 2018.
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