The setting behavior of dispersion adhesives during bonding of Wood Plastic Composites (WPC)
E. Moritzer, M. Hopp, in: 67th Annual Assembly of the International Institute of Welding (IIW), Seoul, Südkorea, 2014.
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67th Annual Assembly of the International Institute of Welding (IIW)
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Moritzer E, Hopp M. The setting behavior of dispersion adhesives during bonding of Wood Plastic Composites (WPC). In: 67th Annual Assembly of the International Institute of Welding (IIW). ; 2014.
Moritzer, E., & Hopp, M. (2014). The setting behavior of dispersion adhesives during bonding of Wood Plastic Composites (WPC). 67th Annual Assembly of the International Institute of Welding (IIW).
@inproceedings{Moritzer_Hopp_2014, place={Seoul, Südkorea}, title={The setting behavior of dispersion adhesives during bonding of Wood Plastic Composites (WPC)}, booktitle={67th Annual Assembly of the International Institute of Welding (IIW)}, author={Moritzer, Elmar and Hopp, Matthias}, year={2014} }
Moritzer, Elmar, and Matthias Hopp. “The Setting Behavior of Dispersion Adhesives during Bonding of Wood Plastic Composites (WPC).” In 67th Annual Assembly of the International Institute of Welding (IIW). Seoul, Südkorea, 2014.
E. Moritzer and M. Hopp, “The setting behavior of dispersion adhesives during bonding of Wood Plastic Composites (WPC),” 2014.
Moritzer, Elmar, and Matthias Hopp. “The Setting Behavior of Dispersion Adhesives during Bonding of Wood Plastic Composites (WPC).” 67th Annual Assembly of the International Institute of Welding (IIW), 2014.
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