An approach to adhesive bond characterisation using guided acoustic waves in multi-layered plates

H. Zeipert, L. Claes, S. Johannesmann, Y. Lugovtsova, M. Nicolai, J. Prager, B. Henning, At - Automatisierungstechnik (2021) 962–969.

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Journal Article | Published | English
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Abstract
An approach for the non-destructive characterisation of adhesive bonds using guided ultrasonic waves is presented. Pulsed laser radiation is used to thermoacoustically excite broadband ultrasonic waves in a multi-layered sample, consisting of a metal plate adhesively joined to a polymeric layer using synthetic resin. The resulting signals are received by a purpose-built piezoelectric transducer. Varying the distance between excitation and detection yields spatio-temporal measurement data, from which the dispersive properties of the propagating waves can be inferred using a two-dimensional Fourier transform, assuming the plates to act as coupled waveguides. Coupled multi-layered waveguides show an effect referred to as <jats:italic>mode repulsion</jats:italic>, where the distance between certain modes in the frequency-wavenumber domain is assumed to be a measure of coupling strength. Measurements at different stages of curing of the adhesive layer are performed and evaluated. A comparison of the results shows changes in the dispersive properties, namely an increased modal bandwidth for the fully cured sample as well as an increased modal distance.
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at - Automatisierungstechnik
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962-969
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Zeipert H, Claes L, Johannesmann S, et al. An approach to adhesive bond characterisation using guided acoustic waves in multi-layered plates. at - Automatisierungstechnik. Published online 2021:962-969. doi:10.1515/auto-2021-0089
Zeipert, H., Claes, L., Johannesmann, S., Lugovtsova, Y., Nicolai, M., Prager, J., & Henning, B. (2021). An approach to adhesive bond characterisation using guided acoustic waves in multi-layered plates. At - Automatisierungstechnik, 962–969. https://doi.org/10.1515/auto-2021-0089
@article{Zeipert_Claes_Johannesmann_Lugovtsova_Nicolai_Prager_Henning_2021, title={An approach to adhesive bond characterisation using guided acoustic waves in multi-layered plates}, DOI={10.1515/auto-2021-0089}, journal={at - Automatisierungstechnik}, author={Zeipert, Henning and Claes, Leander and Johannesmann, Sarah and Lugovtsova, Yevgeniya and Nicolai, Marcel and Prager, Jens and Henning, Bernd}, year={2021}, pages={962–969} }
Zeipert, Henning, Leander Claes, Sarah Johannesmann, Yevgeniya Lugovtsova, Marcel Nicolai, Jens Prager, and Bernd Henning. “An Approach to Adhesive Bond Characterisation Using Guided Acoustic Waves in Multi-Layered Plates.” At - Automatisierungstechnik, 2021, 962–69. https://doi.org/10.1515/auto-2021-0089.
H. Zeipert et al., “An approach to adhesive bond characterisation using guided acoustic waves in multi-layered plates,” at - Automatisierungstechnik, pp. 962–969, 2021, doi: 10.1515/auto-2021-0089.
Zeipert, Henning, et al. “An Approach to Adhesive Bond Characterisation Using Guided Acoustic Waves in Multi-Layered Plates.” At - Automatisierungstechnik, 2021, pp. 962–69, doi:10.1515/auto-2021-0089.

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