AI Assisted Interference Classification to Improve EMC Troubleshooting in Electronic System Development

In this paper, machine learning techniques will be used to classify different PCB layouts given their electromagnetic frequency spectra. These spectra result from a simulated near-field measurement of electric field strengths at different locations. Measured values consist of real and imaginary parts (amplitude and phase) in X, Y and Z directions. Training data was obtained in the time domain by varying transmission line geometries (size, distance and signaling). It was then transformed into the frequency domain and used as deep neural network input. Principal component analysis was applied to reduce the sample dimension. The results show that classifying different designs is possible with high accuracy based on synthetic data. Future work comprises measurements of real, custom-made PCB with varying parameters to adapt the simulation model and also test the neural network. Finally, the trained model could be used to give hints about the error’s cause when overshooting EMC limits.