Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics
J. Kowatz, D. Teutenberg, G. Meschut, International Journal of Adhesion and Adhesives (n.d.).
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International Journal of Adhesion and Adhesives
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Kowatz J, Teutenberg D, Meschut G. Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics. International Journal of Adhesion and Adhesives.
Kowatz, J., Teutenberg, D., & Meschut, G. (n.d.). Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics. International Journal of Adhesion and Adhesives.
@article{Kowatz_Teutenberg_Meschut, title={Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics}, journal={International Journal of Adhesion and Adhesives}, author={Kowatz, Jannik and Teutenberg, Dominik and Meschut, Gerson} }
Kowatz, Jannik, Dominik Teutenberg, and Gerson Meschut. “Optimization of Inductive Fast-Curing of Epoxy Adhesive by Model-Based Kinetics.” International Journal of Adhesion and Adhesives, n.d.
J. Kowatz, D. Teutenberg, and G. Meschut, “Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics,” International Journal of Adhesion and Adhesives.
Kowatz, Jannik, et al. “Optimization of Inductive Fast-Curing of Epoxy Adhesive by Model-Based Kinetics.” International Journal of Adhesion and Adhesives.
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