Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics
J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), IEEE, 2021.
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Reker, Julia;
Meyers, Thorsten;
Vidor, Fabio F.;
Joubert, Trudi-Heleen;
Hilleringmann, UlrichLibreCat
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2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
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Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics. In: 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS). IEEE; 2021. doi:10.1109/fleps51544.2021.9469764
Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., & Hilleringmann, U. (2021). Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics. 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS). https://doi.org/10.1109/fleps51544.2021.9469764
@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics}, DOI={10.1109/fleps51544.2021.9469764}, booktitle={2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }
Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Integration Process for Self-Aligned Sub-Μm Thin-Film Transistors for Flexible Electronics.” In 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS). IEEE, 2021. https://doi.org/10.1109/fleps51544.2021.9469764.
J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics,” 2021, doi: 10.1109/fleps51544.2021.9469764.
Reker, Julia, et al. “Integration Process for Self-Aligned Sub-Μm Thin-Film Transistors for Flexible Electronics.” 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), IEEE, 2021, doi:10.1109/fleps51544.2021.9469764.
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