Application of side-wall deposition and etch-back technology for nanometer scale device integration
U. Hilleringmann, F.F. Vidor, F. Assion, in: Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014), IEEE, 2015.
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Hilleringmann, UlrichLibreCat;
Vidor, F.F.;
Assion, F.
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Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014)
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Hilleringmann U, Vidor FF, Assion F. Application of side-wall deposition and etch-back technology for nanometer scale device integration. In: Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014). IEEE; 2015. doi:10.1109/scat.2014.7055128
Hilleringmann, U., Vidor, F. F., & Assion, F. (2015). Application of side-wall deposition and etch-back technology for nanometer scale device integration. Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014). https://doi.org/10.1109/scat.2014.7055128
@inproceedings{Hilleringmann_Vidor_Assion_2015, title={Application of side-wall deposition and etch-back technology for nanometer scale device integration}, DOI={10.1109/scat.2014.7055128}, booktitle={Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014)}, publisher={IEEE}, author={Hilleringmann, Ulrich and Vidor, F.F. and Assion, F.}, year={2015} }
Hilleringmann, Ulrich, F.F. Vidor, and F. Assion. “Application of Side-Wall Deposition and Etch-Back Technology for Nanometer Scale Device Integration.” In Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014). IEEE, 2015. https://doi.org/10.1109/scat.2014.7055128.
U. Hilleringmann, F. F. Vidor, and F. Assion, “Application of side-wall deposition and etch-back technology for nanometer scale device integration,” 2015, doi: 10.1109/scat.2014.7055128.
Hilleringmann, Ulrich, et al. “Application of Side-Wall Deposition and Etch-Back Technology for Nanometer Scale Device Integration.” Proceedings of the 2nd Pan African International Conference on Science, Computing and Telecommunications (PACT 2014), IEEE, 2015, doi:10.1109/scat.2014.7055128.
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