Semiconductor nanoparticles for electronic device integration on foils
U. Hilleringmann, K. Wolff, F. Assion, F.F. Vidor, G.I. Wirth, in: IEEE Africon ’11, IEEE, 2011.
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Hilleringmann, UlrichLibreCat;
Wolff, K.;
Assion, F.;
Vidor, F. F.;
Wirth, G. I.
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IEEE Africon '11
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Hilleringmann U, Wolff K, Assion F, Vidor FF, Wirth GI. Semiconductor nanoparticles for electronic device integration on foils. In: IEEE Africon ’11. IEEE; 2011. doi:10.1109/afrcon.2011.6071983
Hilleringmann, U., Wolff, K., Assion, F., Vidor, F. F., & Wirth, G. I. (2011). Semiconductor nanoparticles for electronic device integration on foils. IEEE Africon ’11. https://doi.org/10.1109/afrcon.2011.6071983
@inproceedings{Hilleringmann_Wolff_Assion_Vidor_Wirth_2011, title={Semiconductor nanoparticles for electronic device integration on foils}, DOI={10.1109/afrcon.2011.6071983}, booktitle={IEEE Africon ’11}, publisher={IEEE}, author={Hilleringmann, Ulrich and Wolff, K. and Assion, F. and Vidor, F. F. and Wirth, G. I.}, year={2011} }
Hilleringmann, Ulrich, K. Wolff, F. Assion, F. F. Vidor, and G. I. Wirth. “Semiconductor Nanoparticles for Electronic Device Integration on Foils.” In IEEE Africon ’11. IEEE, 2011. https://doi.org/10.1109/afrcon.2011.6071983.
U. Hilleringmann, K. Wolff, F. Assion, F. F. Vidor, and G. I. Wirth, “Semiconductor nanoparticles for electronic device integration on foils,” 2011, doi: 10.1109/afrcon.2011.6071983.
Hilleringmann, Ulrich, et al. “Semiconductor Nanoparticles for Electronic Device Integration on Foils.” IEEE Africon ’11, IEEE, 2011, doi:10.1109/afrcon.2011.6071983.
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